Copper provides superior thermal conductivity (385-400 W/m·K) compared to aluminum (150-200 W/m·K), offering approximately 2x better heat transfer. However, copper is significantly heavier and more expensive. For most consumer electronics applications, aluminum 6063-T5 or 6061-T6 provides excellent thermal performance with lower weight and cost. Copper is recommended for high-power density applications or where maximum thermal performance is critical. Hybrid designs combining copper base plates with aluminum fins can optimize performance and cost. Our team can recommend the best material based on your thermal budget, weight constraints, and cost targets.